Scotch-Weld AF111 Solvent Resistant Thermal Bonding Film, 36 yd Roll L, 250 deg F, 60 min Curing

Scotch-Weld Thermal Bonding Film, Solvent Resistant, 36 yd Roll L, 250 deg F, 60 min Curing, 3 piw Peal Strength, 450 psi Shear Strength, 7200 psi Tensile, Plastic, Off-White

• Epoxy, thermoset film adhesive developed for structural bonding of metals and high strength plastic materials (epoxy and phenolic)
• High metal OLS and peel adhesion
• Moderate tack
• High flow
• Epoxy base resin and 1.9 mil red polyethylene liner on 10 mil tacky adhesive over 6 mil brown paper liner construction
• 10% elongation
• 150000 psi modulus
• 38 piw adhesion strength
• 1/2 in W