Scotch-Weld AF42 Solvent Resistant Thermal Bonding Film, 72 yd Roll L, 350 deg F, 60 min Curing

Scotch-Weld Thermal Bonding Film, Solvent Resistant, 72 yd Roll L, 350 deg F, 60 min Curing, 11 piw Peal Strength, 600 psi Shear Strength, 4800 psi Tensile, Plastic, Clear

• Epoxy, thermoset film adhesive developed for structural bonding of metal, glass and other engineering grade substances for electronics applications
• Tough, high peel strength
• No tack, low flow
• Cures clear
• Epoxy base resin and 3 mil non-tacky thermoset adhesive with 6.5 mil brown paper liner
• 250% elongation at break
• 65000 psi modulus
• 60 piw adhesion strength
• 4 in W