3M Diamond Lapping Film 662XW Type H, 1 Micron Disc, 5 in x NH Die# 500X, 25 per inner 250 per case, Telcom

3M™ Diamond Lapping Film 662XW has a higher diamond concentration and a stronger resin bond to give this product added durability and increased cut rate over our standard diamond lapping film. Available in 0.50, 1.0, 1.50, 3.0, 6.0 and 9.0 micron grades.